WAFER CUTTING MACHINE

WAFER CUTTING MACHINE

It is a machine that cuts the wafer blocks coming out of the block cooling machine into the desired sizes. The cut wafers are fed individually or as blocks into the packaging machine by pushers. It is possible to make bi-directional cutting in two different sizes. Depending on customer request, the wafer cutting machine can be manufactured in single or double output.

Technical Specifications

ELECTRIC POWER2,2 kW
CAPACITY15 Cut/Min.
USED MATERIALSAISI 304

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